TSMC reportedly considers CoWoS price increase of up to 20%

TrendForce reported on October 27, 2026, that TSMC was considering raising CoWoS prices, with the increase potentially reaching 20%.[1] Commercial Times separately reported that another increase was under consideration and could also reach 20%.[3] The reports describe the increase as under consideration.[1][3] For procurement teams, the distinction matters: the reported figure is a possible increase.[1][3]

TrendForce attributed the pricing consideration to an AI demand surge and said increasingly large AI accelerators are straining advanced packaging capacity.[1] It described TSMC’s CoWoS supply as tight.[1] Commercial Times reported that AI chips are competing for capacity and that pressure from tight capacity is continuing to increase.[3] Tom’s Hardware reported that Nvidia’s Blackwell and Rubin chips are adding pressure to packaging capacity.[2] Together, the reports point to a capacity constraint alongside the potential price increase.[1][2]

TrendForce’s headline says TSMC is skipping equipment price renegotiations.[1] Commercial Times reported that capacity competition is also affecting equipment suppliers, and that customers are too pressed to bargain prices down.[3] It also reported that customers would place orders if suppliers could commit to delivery dates.[3] Both Tom’s Hardware and Commercial Times reported equipment lead times stretching to as much as eight months.[2][3] Commercial Times said suppliers across the chain were focused on deliveries and expanding capacity.[3]