TSMC considers expanding into advanced memory chip manufacturing

The Information reported that TSMC is considering expanding into advanced memory chip manufacturing, describing the idea as a way to capture more AI spending and gain a larger share of the AI hardware supply chain.[1] Its report cited two people with direct knowledge of the matter.[1] The Next Web reported that TSMC is drafting plans to make 3D DRAM chips, while CNBC TV18 said the company recently started charting plans for 3D DRAM.[2][3] CNBC TV18 also said its account cited two people with direct knowledge.[3]

The Information reported that Nvidia asked suppliers of its next-generation custom high-bandwidth memory chip to use TSMC’s 3-nanometer process.[4] It named Samsung Electronics, SK Hynix and Micron as the suppliers Nvidia asked to standardize on that technology.[4] The process would be used to produce base dies, which The Information described as core components of the memory chips.[4] The Information attributed its account of Nvidia’s request to the Seoul Economic Daily.[4] This reported supplier request concerns base dies; it is distinct from the reports that TSMC may make memory chips itself.[1][2][4]

The Next Web said a potential TSMC move would put the company in competition with Samsung and SK Hynix, and described an AI-driven memory shortage as ongoing.[2] It characterized TSMC’s work as plans, while The Information described an expansion the company is considering.[1][2] Those descriptions do not establish that TSMC has begun manufacturing the memory chips or that the plans will proceed.[1][2][3] The Information described TSMC as the world’s largest chipmaker.[1] The Next Web published its report on November 6, 2026.[2]