Samsung outlines memory and storage plans for AI infrastructure

Samsung presented the strategies at the 2026 OCP Global Summit, which opened Monday local time.[1] Its three directions were high-performance memory, CXL-based memory expansion, and next-generation SSD storage and management.[1] Samsung corporate vice president Shim Ho-jun, who leads its application engineering team, delivered a presentation at the summit.[1] Samsung said it is expanding early-stage co-design and technical validation with global customers and partners to optimize AI systems.[1] The company also said it is seeking a larger role in AI system design through closer work with customers and technology partners.[3]

Samsung and AMD jointly demonstrated technology that allows multiple servers to share a common pool of memory for AI inference.[2] CXL links servers to pooled memory, allowing a server with a heavy AI workload to borrow capacity and return it when finished.[2] The demonstration addressed a limitation of servers using only internally installed memory: one machine may have idle capacity while another runs short.[2] Samsung said the joint demonstration validated the technology in an actual system with a global computing-platform company.[2] The evidence describes a demonstration and validation, not broad deployment.[2]

Samsung identified HBM5 and custom HBM among its high-performance memory technologies.[2] Its exhibition also included HBM4E, HBM5 and custom-HBM concept mock-ups, as well as LPDDR5X-PIM.[2] The company’s KV-Cache Solutions exhibition featured CXL memory, enterprise SSDs, and technologies for storing KV cache.[2] Samsung said high-capacity quad-level-cell flash and flexible data-placement technologies intended to improve storage efficiency are in development.[3]

Samsung’s MAX Lab allows customers to test precommercial memory and storage products under realistic AI workloads, so system needs can inform development earlier.[3] Separately, Samsung and AMD signed an MOU to expand collaboration on next-generation AI memory and computing technologies.[4] Under the MOU, the companies planned to align on HBM4 supply for AMD’s MI455X accelerator and advanced DRAM for sixth-generation EPYC processors.[4] The announcement sets out planned alignment, rather than confirming completed supply.[4] Samsung participated in the summit as a Diamond sponsor, the event’s top sponsorship tier.[2]