GlobalFoundries announces $2 billion interposer deal with TSMC

GlobalFoundries said the agreement will establish the first U.S.-based source of silicon interposers supporting advanced-packaging technologies.[1] The planned supply will support TSMC’s CoWoS advanced-packaging ecosystem.[1] GlobalFoundries will provide manufacturing services to TSMC under the deal.[1] The company dated its announcement October 8, 2026.[1]

The agreement is valued at $2 billion and has an initial term of five years.[1] GlobalFoundries will add fabrication capacity at its Malta, New York, facility, where it expects volume production to begin ramping during the first half of 2028.[1] The company said the additional capacity is intended to provide greater scale and flexibility across multiple product generations.[1] It also described the agreement as a foundation for expanding capacity over time as customer demand grows.[1]

The planned interposer supply will support TSMC’s CoWoS advanced-packaging ecosystem and include support for embedded deep trench capacitor components, according to GlobalFoundries.[1] CNA reported that a silicon interposer sits beneath processors and memory chips inside advanced AI packages.[2] The Register described interposers as providing a faster, lower-power communications path between compute logic and memory than conventional organic packaging.[3] GlobalFoundries said the agreement is intended to support growing demand for high-performance computing and AI systems.[1]

The Register described advanced packaging as a bottleneck for U.S. chip manufacturing.[3] It reported that TSMC had contracted with Amkor for U.S. CoWoS-compatible packaging services and had begun building its own advanced-packaging facilities in Arizona.[3] The outlet said the Amkor and TSMC facilities were not expected to come online until 2028 and 2029, respectively.[3] It also reported that the technology is compatible with silicon produced at TSMC fabs.[3] These reports provide context for the timing and supply-chain role of GlobalFoundries’ planned interposer capacity.[1]