Broadcom Backers Assemble $60 Billion AI Chip Debt Package

Broadcom’s backers are assembling a $60 billion debt package to help AI companies and large corporations secure advanced chips and supporting data-center infrastructure. [1][2][3] Wall Street banks plan to syndicate a $42 billion class A senior-secured tranche, while Blackstone is leading an $18 billion class B junior-debt tranche. [3] Blackstone is expected to commit $9 billion to the junior tranche before selling the remainder to other investors. [3] The senior tranche would be repaid first, while the junior tranche would absorb losses first if the financing encountered problems. [3]

The debt is intended to finance AI computing capacity when advanced chips and the associated power, servers, and networking can be difficult to secure quickly. [3] Customers could include groups linked to Amazon partner Anthropic, while Amazon is separately reported to be considering an $8 billion off-balance-sheet deal for Nvidia AI chips. [2][3]

The financing plan shows how one AI-infrastructure project can combine syndicated bank debt with a private-capital-led junior tranche. Its proposed scale exceeds Amazon’s reported $8 billion Nvidia chip financing under consideration, although the sources do not present the arrangements as identical. The practical watchpoint is whether Broadcom’s package retains its proposed senior-junior structure as lenders place the debt. What the sources don't address: the borrowing cost, final investor roster, closing timetable, or specific chip volumes the financing would support.